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DSPIC33FJ32MC304-I/SP View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
DSPIC33FJ32MC304-I/SP Datasheet PDF : 460 Pages
First Prev 421 422 423 424 425 426 427 428 429 430 Next Last
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
33.0 PACKAGING INFORMATION
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ32MC
302-E/SP e3
0730235
28-Lead SOIC (.300”)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ32MC
302-E/SO e3
0730235
28-Lead QFN-S
Example
XXXXXXXX
XXXXXXXX
YYWWNNN
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
44-Lead TQFP
33FJ32MC
302EMM e3
0730235
Example
dsPIC
33FJ32MC304
-E/ML e3
0730235
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC
33FJ32MC304
-I/PT e3
0730235
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
© 2007-2012 Microchip Technology Inc.
DS70291G-page 429

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