STM32F091CB View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F091CB

STMicroelectronics

STM32F091CB Datasheet PDF : 128 Pages

First Prev 121 122 123 124 125 126 127 128

STM32F091xB STM32F091xC

Package information

7.8

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 24: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 80. Package thermal characteristics

Symbol

Parameter