STM32F373VBT7(2013) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F373VBT7
(Rev.:2013)

ARM Cortex-M4 32b MCU+FPU, up to 256KB Flash+32KB SRAM timers, 4 ADCs (12/16-bit), 3 DACs, 2 comp., 2.0-3.6 V operation

STMicroelectronics 

Electrical characteristics

STM32F37xxx

6.3.2

Table 22. General operating conditions (continued)

Symbol

Parameter

Conditions

Min Max Unit

LQFP100

Power dissipation at TA = 85 °C LQFP64

PD

for suffix 6 or TA = 105 °C for

suffix 7(4)

LQFP48

BGA100

434

444

mW

364

338

Ambient temperature for 6 suffix Maximum power dissipation –40

version

Low power dissipation(5)

–40

85

105

°C

TA

Ambient temperature for 7 suffix Maximum power dissipation –40

version

Low power dissipation(5)

–40

105

125

°C

TJ

Junction temperature range

6 suffix version

7 suffix version

–40 105

°C

–40 125

1. When the ADC is used, refer to Table 60: ADC characteristics.

2. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

3. VDDSD12 is the external power supply for the PB2, PB10, and PE7 to PE15 I/O pins (the I/O pin ground is

internally connected to VSS). VDDSD3 is the external power supply for PB14 to PB15 and PD8 to PD15

I/O pins (the I/O pin ground is internally connected to VSS).

4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.

5. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.

Operating conditions at power-up / power-down

The parameters given in Table 23 are derived from tests performed under the ambient

temperature condition summarized in Table 22.

Table 23. Operating conditions at power-up / power-down

Symbol

Parameter

Conditions

Min

Max

tVDD

tVDDA

VDD rise time rate

VDD fall time rate

VDDA rise time rate

VDDA fall time rate

0

∞

20

∞

0

∞

20

∞

Unit

µs/V

58/131

DocID022691 Rev 4

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