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STM32F302CBT6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STM32F302CBT6 Datasheet PDF : 144 Pages
First Prev 131 132 133 134 135 136 137 138 139 140 Next Last
Package information
STM32F302xB STM32F302xC
Table 84. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale
package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Typ
Min
Max
A
A1
A2
A3(2)
Ø b(3)
D
E
e
e1
e2
F
G
N
aaa
bbb
ccc
ddd
eee
0.525
-
-
-
0.22
4.166
4.628
-
-
-
-
-
-
-
-
-
-
-
0.555
0.17
0.38
0.025
0.25
4.201
4.663
0.4
3.6
3.6
0.3005
0.5315
100
0.1
0.1
0.1
0.05
0.05
0.585
-
-
-
0.28
4.236
4.698
-
-
-
-
-
-
-
-
-
-
-
0.0207
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.0219
0.0067
0.0150
0.0010
0.0098
0.1654
0.1836
0.0157
0.1417
0.1417
0.0118
0.0209
3.9370
0.0039
0.0039
0.0039
0.0020
0.0020
0.0230
-
-
-
0.0110
0.1668
0.1850
-
-
-
-
-
-
-
-
-
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
134/144
DocID025186 Rev 7

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