STM32F302CCY6TR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F302CCY6TR

ARM®-based Cortex®-M4 32b MCU+FPU, up to 256KB Flash+ 40KB SRAM, 2 ADCs, 1 DAC ch., 4 comp, 2 PGA, timers, 2.0-3.6 V

STMicroelectronics 

STM32F302xB STM32F302xC

Package information

7.5

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 24: General operating conditions on page 58.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 86. Package thermal characteristics

Symbol

Parameter

Value

Thermal resistance junction-ambient

LQFP64 - 10 × 10 mm / 0.5 mm pitch

45

Thermal resistance junction-ambient

LQFP48 - 7 × 7 mm

55

ΘJA

Thermal resistance junction-ambient

LQFP100 - 14 × 14 mm / 0.5 mm pitch

41

Thermal resistance junction-ambient

WLCSP100 - 0.4 mm pitch

40

Unit

°C/W

7.5.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

DocID025186 Rev 7

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