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ST10F276-4TR3 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST10F276-4TR3 Datasheet PDF : 235 Pages
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Internal Flash memory
4
Internal Flash memory
ST10F276E
4.1
Overview
The on-chip Flash is composed of two matrix modules, each one containing one array
divided in two banks that can be read and modified independently of one another: one bank
can be read while another bank is under modification.
Figure 4. Flash modules structure
)&,!3(-ODULE)
#ONTROLSECTION
8&,!3(-ODULE8
"ANK+BYTE
PROGRAMMEMORY
(6AND2EF
GENERATOR
"ANK+BYTE
PROGRAMMEMORY
"ANK+BYTE
PROGRAMMEMORY
+BYTETEST&LASH
0ROGRAMERASE
CONTROLLER
"ANK+BYTE
PROGRAMMEMORY
)"53INTERFACE
8"53INTERFACE
'!0'2)
The write operations of the four banks are managed by an embedded Flash program/erase
controller (FPEC). The high voltages needed for program/erase operations are internally
generated.
The data bus is 32-bit wide. Due to ST10 core architecture limitation, only the first
512 Kbytes are accessed at 32-bit (internal Flash bus, see I-BUS), while the remaining
320 Kbytes are accessed at 16-bit (see X-BUS).
4.2
4.2.1
Functional description
Structure
Table 2 shows the address space reserved to the Flash module.
Table 2. Flash modules absolute mapping
Description
IFLASH sectors
XFLASH sectors
Registers and Flash internal reserved area
Addresses
0x00 0000 to 0x08 FFFF
0x09 0000 to 0x0D FFFF
0x0E 0000 to 0x0E FFFF
Size
512 Kbyte
320 Kbyte
64 Kbyte
24/235
Doc ID 12303 Rev 3

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