DSPIC30F2012AT-20E/ML View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
DSPIC30F2012AT-20E/ML Datasheet PDF : 206 Pages
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dsPIC30F2011/2012/3012/3013
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Trademark
d s P I C 3 0 F 3 0 1 3 AT- 3 0 I / S P - E S
Custom ID (3 digits) or
Engineering Sample (ES)
Architecture
Flash
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Package
P = DIP
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Speed
20 = 20 MIPS
30 = 30 MIPS
T = Tape and Reel
Example:
dsPIC30F3013AT-30I/SP = 30 MIPS, Industrial temp., SPDIP package, Rev. A
A,B,C… = Revision Level
© 2008 Microchip Technology Inc.
DS70139F-page 205
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