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STPS10170CB View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STPS10170CB
ST-Microelectronics
STMicroelectronics 
STPS10170CB Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package dimensions
STPS10170C
Table 7. D2PAK dimensions
Dimensions
Ref. Millimeters
Inches
A
Min. Max Min. Max.
E
L2
C2
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
D B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
L3
A1
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
B2
B
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G
G 4.88 5.28 0.192 0.208
A2
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
M*
L3
V2
M
* FLAT ZONE NO LESS THAN 2mm R
1.40 1.75
2.40 3.20
0.40 typ.
0.055 0.069
0.094 0.126
0.016 typ.
V2 0°
Figure 13. D2PAK footprint (dimensions in mm)
16.90
10.30
5.08
1.30
3.70
8.90
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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