13.4 8-contact 6x5 WSON Cont’d.
FM25Q32
SYMBOL
M
N
P
Q
R
MILLIMETERS
MIN
TYP.
MAX
MIN
SOLDER PATTERN
3.40
4.30
6.00
0.50
0.75
INCHES
TYP.
MAX
0.1338
0.1692
0.2360
0.0196
0.0255
Notes:
1. Advanced Packaging Information; please contact FIDELIX SEMICONDUCTOR for the latest
minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom
of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND
pin). Avoid placement of exposed PCB bias under the pad.
preliminary(Aug.18.2010) 59