STM8AF61xx, STM8AF62xx
14 Revision history
Revision history
Table 52. Document revision history
Date
Revision
Changes
22-Aug-2008
1
Initial release
10-Aug-2009
22-Oct-2009
08-Jul-2010
Document revised as the following:
Updated Features on page 1;
Updated Table 1: Device summary;
Updated Section 3: Product line-up;
Changed Section 5: Product overview;
Updated Section 6: Pinouts and pin description;
2
Changed Section 7.2: Register map;
Updated Section 8: Interrupt table;
Updated Section 9: Option bytes;
Updated Section 10: Electrical characteristics;
Updated Section 11: Package characteristics;
Updated Section 12: Ordering information;
Added Section 13: STM8 development tools.
Adapted Table 10: STM8AF61xx/62xx (32 Kbytes) microcontroller
pin description.
3
Added Section 13.4.5: LIN header error when automatic
resynchronization is enabled.
Updated title on cover page.
Added VFQFPN32 5x 5 mm package.
Added STM8AF62xx devices, and modified cover page header to
clarify the part numbers covered by the datasheets. Updated Note 1
below Table 1: Device summary.
Updated D temperature range to -40 to 150°C.
Content of Section 5: Product overview reorganized.
Renamed Section 7 Memory and register map, and content merged
with Register map section.
Renamed BL_EN and NBL_EN, BL and NBL, respectively, in
Table 17: Option bytes.
4
Added Table 22: Operating lifetime.
Added CEXT and PD (power dissipation) in Table 23: General
operating conditions, and Section 10.3.1: VCAP external capacitor.
Suffix D maximum junction temperature (TJ) updated in Table 23:
General operating conditions.
Update tVDD in Table 24: Operating conditions at power-up/power-
down.
Moved Table 29: Typical peripheral current consumption VDD = 5.0 V
to Section : Current consumption for on-chip peripherals and
removed IDD(CAN).
Updated Section 12: Ordering information for the devices supported
by the datasheet.
Updated Section 13: STM8 development tools.
Doc ID 14952 Rev 6
85/89