DSPIC33FJ128GP304-I/ML View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

DSPIC33FJ128GP304-I/ML

High-Performance, 16-bit Digital Signal Controllers

Microchip Technology 

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04

30.1 DC Characteristics

TABLE 30-1: OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temp Range

(in °C)

3.0-3.6V

3.0-3.6V

-40°C to +85°C

-40°C to +125°C

Max MIPS

dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04, and

dsPIC33FJ128GPX02/X04

40

40

TABLE 30-2: THERMAL OPERATING CONDITIONS

Rating

Industrial Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Extended Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD –  IOH)

I/O Pin Power Dissipation:

I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

Symbol Min

Typ

Max Unit

TJ

-40

—

+125

°C

TA

-40

—

+85

°C

TJ

-40

—

+140

°C

TA

-40

—

+125

°C

PD

PINT + PI/O

W

PDMAX

(TJ – TA)/JA

W

TABLE 30-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol Typ Max Unit Notes

Package Thermal Resistance, 44-pin QFN

JA

30

—

°C/W

1

Package Thermal Resistance, 44-pin TFQP

JA

40

—

°C/W

1

Package Thermal Resistance, 28-pin SPDIP

JA

45

—

°C/W

1

Package Thermal Resistance, 28-pin SOIC

JA

50

—

°C/W

1

Package Thermal Resistance, 28-pin QFN-S

JA

30

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.

DS70292D-page 322

Preliminary

 2009 Microchip Technology Inc.

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