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DSPIC33FJ32GP802-I/SP View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
DSPIC33FJ32GP802-I/SP
Microchip
Microchip Technology 
DSPIC33FJ32GP802-I/SP Datasheet PDF : 402 Pages
First Prev 401 402
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC 33 FJ 32 GP3 02 T E / SP - XXX
Microchip Trademark
Architecture
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
Examples:
a) dsPIC33FJ32GP302-E/SP:
General Purpose dsPIC33, 32 KB program
memory, 28-pin, Extended temperature,
SPDIP package.
Architecture:
33 = 16-bit Digital Signal Controller
Flash Memory Family: FJ = Flash program memory, 3.3V
Product Group:
GP2 = General Purpose family
GP3 = General Purpose family
GP8 = General Purpose family
Pin Count:
02 = 28-pin
04 = 44-pin
Temperature Range: I
E
H
= -40C to+85C (Industrial)
= -40C to+125C (Extended)
= -40C to+140C (High)
Package:
SP = Skinny Plastic Dual In-Line - 300 mil body (SPDIP)
SO = Plastic Small Outline - Wide - 300 mil body (SOIC)
ML = Plastic Quad, No Lead Package - 8x8 mm body (QFN)
MM = Plastic Quad, No Lead Package - 6x6x0.9 mm body (QFN-S)
PT = Plastic Thin Quad Flatpack - 10x10x1 mm body (TQFP)
2009 Microchip Technology Inc.
Preliminary
DS70292D-page 401

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