DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

LT3060IDC-3.3-TR View Datasheet(PDF) - Linear Technology

Part Name
Description
Manufacturer
LT3060IDC-3.3-TR Datasheet PDF : 26 Pages
First Prev 21 22 23 24 25 26
Package Description
DC Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev A)
LT3060 Series
2.55 ±0.05
1.15
±0.05
0.64 ±0.05
(2 SIDES)
0.70 ±0.05
PACKAGE
OUTLINE
1.37 ±0.05
(2 SIDES)
0.25 ± 0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.05
TYP
R = 0.115
TYP
5
8
0.40 ± 0.10
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ±0.10 0.64 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
(DC8) DFN 0409 REVA
4
1
0.23 ± 0.05
0.45 BSC
1.37 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3060fa
23

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]