ST72334J4TC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72334J4TC

8-bit MCU for automotive with single voltage Flash/ROM memory, ADC, 16-bit timers, SPI, SCI interfaces

STMicroelectronics 

ST72334xx-Auto, ST72314xx-Auto, ST72124Jx-Auto

PACKAGE CHARACTERISTICS (Cont’d)

16.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

TQFP64

TQFP44

Power dissipation 1)

Maximum junction temperature 2)

Value

60

52

500

150

Unit

°C/W

mW

°C

Notes:

1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power

(IDD x VDD) and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

16.3 ECOPACK®

In order to meet environmental requirements, ST

offers these devices in ECOPACK® packages.

These packages have a lead-free second level in-

terconnect. The category of second level intercon-

nect is marked on the package and on the inner

box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to solder-

ing conditions are also marked on the inner box la-

bel.

ECOPACK is an ST trademark. ECOPACK® spec-

ifications are available at www.st.com.

142/150

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