EP3C5E324A8ES View Datasheet(PDF) - Altera Corporation

Part Name

Description

Manufacturer

EP3C5E324A8ES

Cyclone III Device Handbook

Altera Corporation 

6–22

Chapter 6: I/O Features in the Cyclone III Device Family

Document Revision History

Table 6–7. Document Revision History (Part 2 of 3)

Date

October 2008

May 2008

Version

Changes

■ Added (Note 6) to Table 6–5.

■ Updated the “I/O Banks” section.

■ Updated the “Differential Pad Placement Guidelines” section.

2.1 ■ Updated the “VREF Pad Placement Guidelines” section.

■ Removed any mention of “RSDS and PPDS are registered trademarks of National

Semiconductor” from chapter.

■ Updated chapter to new template.

Changes include addition of BLVDS information.

■ Added an introduction to “I/O Element Features” section.

■ Updated “Slew Rate Control” section.

■ Updated “Programmable Delay” section.

■ Updated Table 6–1 with BLVDS information.

■ Updated Table 6–2.

■ Updated “PCI-Clamp Diode” section.

■ Updated “LVDS Transmitter Programmable Pre-Emphasis” section.

■ Updated “On-Chip Termination with Calibration” section and added new Figure 6–9.

■ Updated Table 6–3 title.

■ Updated Table 6–4 unit.

■ Updated “I/O Standards” section and Table 6–5 with BLVDS information and added

2.0

(Note 5).

■ Updated “Differential I/O Standard Termination” section with BLVDS information.

■ Updated “I/O Banks” section.

■ Updated (Note 2) and added (Note 7) and BLVDS information to Figure 6–15.

■ Updated (Note 2) and added BLVDS information to Table 6–6.

■ Added MBGA package information to Table 6–7.

■ Deleted Table 6-8.

■ Updated “High-Speed Differential Interfaces” section with BLVDS information.

■ Updated “Differential Pad Placement Guidelines” section and added new Figure 6–16.

■ Updated “VREF Pad Placement Guidelines” section and added new Figure 6–17.

■ Updated Table 6–11.

■ Added new “DCLK Pad Placement Guidelines” section.

■ Updated “DC Guidelines” section.

Cyclone III Device Handbook

Volume 1

July 2012 Altera Corporation

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