STM32F100VCT6BTR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F100VCT6BTR

High-density value line, advanced ARM-based 32-bit MCU with 256 to 512 KB Flash, 16 timers, ADC, DAC & 11 comm interfaces

STMicroelectronics 

Electrical characteristics

STM32F100xC, STM32F100xD, STM32F100xE

Note:

5.3.2

Table 9. General operating conditions (continued)

Symbol

Parameter

Conditions

Min Max Unit

Power dissipation at TA =

PD

85 °C for suffix 6 or TA =

105 °C for suffix 7(2)

LQFP144

LQFP100

LQFP64

666

434 mW

444

Ambient temperature for 6

suffix version

Maximum power dissipation –40 85

Low power dissipation(3)

–40 105

°C

TA

Ambient temperature for 7

suffix version

Maximum power dissipation –40 105

Low power dissipation(3)

–40 125

°C

6 suffix version

TJ

Junction temperature range

7 suffix version

–40 105

°C

–40 125

1. When the ADC is used, refer to Table 51: ADC characteristics.

2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 6.2:

Thermal characteristics on page 92).

3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Section 6.2: Thermal characteristics on page 92).

It is recommended to power VDD and VDDA from the same source. A maximum difference of

300 mV between VDD and VDDA can be tolerated during power-up and operation

Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 10. Operating conditions at power-up / power-down

Symbol

Parameter

Min

Max

Unit

tVDD

VDD rise time rate

VDD fall time rate

0

∞

µs/V

20

∞

38/98

Doc ID 15081 Rev 7

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