STM32F100RCT6BTR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F100RCT6BTR

High-density value line, advanced ARM-based 32-bit MCU with 256 to 512 KB Flash, 16 timers, ADC, DAC & 11 comm interfaces

STMicroelectronics 

Package characteristics

STM32F100xC, STM32F100xD, STM32F100xE

6.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 9: General operating conditions on page 37.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

● TA max is the maximum ambient temperature in ° C,

● ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 60. Package thermal characteristics

Symbol

Parameter

Thermal resistance junction-ambient

LQFP 144 - 20 × 20 mm / 0.5 mm pitch

ΘJA

Thermal resistance junction-ambient

LQFP 100 - 14 × 14 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP 64 - 10 × 10 mm / 0.5 mm pitch

Value

35

40

49

Unit

°C/W

6.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org.

92/98

Doc ID 15081 Rev 7

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