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STP08CP05XTTR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STP08CP05XTTR Datasheet PDF : 31 Pages
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Typical characteristics
STP08CP05
Figure 13. Power dissipation vs temperature package
Note:
The exposed-pad should be soldered to the PBC to realize the thermal benefits.
Figure 14. Current precision between outputs vs output current
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
1
10
100
Iset (mA)
16/31
DocID13524 Rev 6

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