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ST7PLIT110BY0M3 View Datasheet(PDF) - STMicroelectronics

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ST7PLIT110BY0M3 Datasheet PDF : 159 Pages
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ST7LITE1xB
Table 24. THERMAL CHARACTERISTICS
Symbol
RthJA
TJmax
PDmax
Ratings
Package thermal resistance
(junction to ambient)
Maximum junction temperature 1)
Power dissipation 2)
DIP16/SO16
DIP20/SO20
QFN20 (on 4-layer PCB)
QFN20 (on 2-layer PCB)
DIP16/SO16
DIP20/SO20
Value
85
85
43
95
150
300
300
Unit
°C/W
°C
mW
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the
chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application.
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