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STM32F301X6(2014) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STM32F301X6 Datasheet PDF : 132 Pages
First Prev 111 112 113 114 115 116 117 118 119 120 Next Last
Package characteristics
STM32F301x6 STM32F301x8
Figure 35. WLCSP49 wafer level chip size package
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1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
2. Bump position designation per JESD 95-1, SPP-010.
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DocID025146 Rev 3

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