STM32F301C8T7(2014) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F301C8T7
(Rev.:2014)

ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash, 16 KB SRAM, ADC, DAC, COMP, Op-Amp, 2.0 – 3.6 V

STMicroelectronics 

Package characteristics

STM32F301x6 STM32F301x8

Figure 43. 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)

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1. Drawing is not to scale.

2. There is an exposed die pad on the underside of the UFQFPN package. This pad is not internally

connected to the VSS or VDD power pads. It is recommended to connect it to VSS.

3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.

Table 77. 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

0.550

0.500

0.600

0.0217

0.0197

0.0236

A1

0.020

0.000

0.050

0.0008

0.0000

0.0020

A3

0.200

-

-

0.0079

-

-

b

0.250

0.180

0.300

0.0098

0.0071

0.0118

D

5.000

4.850

5.150

0.1969

0.1909

0.2028

D2

3.450

3.200

3.700

0.1358

0.1260

0.1457

E

5.000

4.850

5.150

0.1969

0.1909

0.2028

E2

3.450

3.200

3.700

0.1358

0.1260

0.1457

e

0.500

-

-

0.0197

-

-

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DocID025146 Rev 3

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