STM32F301C6U6(2014) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F301C6U6
(Rev.:2014)

ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash, 16 KB SRAM, ADC, DAC, COMP, Op-Amp, 2.0 – 3.6 V

STMicroelectronics 

STM32F301x6 STM32F301x8

Package characteristics

7.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 23: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x JA)

Where:

 TA max is the maximum ambient temperature in °C,

 JA is the package junction-to-ambient thermal resistance, in C/W,

 PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

 PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 78. Package thermal characteristics

Symbol

Parameter

Value

Thermal resistance junction-ambient

LQFP64 - 10 × 10 mm / 0.5 mm pitch

45

Thermal resistance junction-ambient

LQFP48 - 7 × 7 mm

55

JA

Thermal resistance junction-ambient

WCSP49 - 3.4 x 3.4 mm

49

Thermal resistance junction-ambient

UFQFN32 - 5 x 5 mm

37

Unit

°C/W

7.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

DocID025146 Rev 3

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