STM32F301R8U7TR(2014) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F301R8U7TR
(Rev.:2014)

ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash, 16 KB SRAM, ADC, DAC, COMP, Op-Amp, 2.0 – 3.6 V

STMicroelectronics 

Electrical characteristics

STM32F301x6 STM32F301x8

6.2

Absolute maximum ratings

Stresses above the absolute maximum ratings listed in Table 20: Voltage characteristics,

Table 21: Current characteristics, and Table 22: Thermal characteristics may cause

permanent damage to the device. These are stress ratings only and functional operation of

the device at these conditions is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

V

Table 20. Voltage characteristics(1)

Symbol

Ratings

Min

Max

Unit

VDD–VSS

External main supply voltage (including VDDA, VBAT

and VDD)

-0.3

4.0

V

VDD–VDDA Allowed voltage difference for VDD > VDDA

-

0.4

V

Input voltage on FT and FTf pins

VSS  0.3

VDD + 4.0

VIN(2)

Input voltage on TTa and TT pins

Input voltage on any other pin

VSS  0.3

VSS 0.3

4.0

4.0

V

Input voltage on Boot0 pin

0

9

|VDDx|

Variations between different VDD power pins

-

|VSSX VSS| Variations between all the different ground pins

-

50

mV

50

VESD(HBM)

Electrostatic discharge voltage (human body

model)

see Section 6.3.12: Electrical

sensitivity characteristics

V

1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the

permitted range. The following relationship must be respected between VDDA and VDD:

VDDA must power on before or at the same time as VDD in the power up sequence.

VDDA must be greater than or equal to VDD.

2. VIN maximum must always be respected. Refer to Table 21: Current characteristics for the maximum allowed injected

current values.

Symbol

IVDD

IVSS

IVDD

IVSS

IIO(PIN)

IIO(PIN)

IINJ(PIN)

IINJ(PIN)

Table 21. Current characteristics

Ratings

Total current into sum of all VDD_x power lines (source)

Total current out of sum of all VSS_x ground lines (sink)

Maximum current into each VDD_x power line (source)(1)

Maximum current out of each VSS _x ground line (sink)(1)

Output current sunk by any I/O and control pin

Output current sourced by any I/O and control pin

Total output current sunk by sum of all IOs and control pins(2)

Total output current sourced by sum of all IOs and control pins(2)

Injected current on TT, FT, FTf and B pins(3)

Injected current on TC and RST pin(4)

Injected current on TTa pins(5)

Total injected current (sum of all I/O and control pins)(6)

Max.

Unit

130

-130

100

-100

25

-25

mA

80

-80

-5/+0

+/-5

+/-5

+/-25

54/132

DocID025146 Rev 3

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