STM32F301C8T7(2014) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F301C8T7
(Rev.:2014)

ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash, 16 KB SRAM, ADC, DAC, COMP, Op-Amp, 2.0 – 3.6 V

STMicroelectronics 

Electrical characteristics

STM32F301x6 STM32F301x8

6.3

6.3.1

Operating conditions

General operating conditions

Table 23. General operating conditions

Symbol

Parameter

Conditions

Min Max Unit

fHCLK

fPCLK1

fPCLK2

VDD

VDDA

VBAT

VIN

PD

TA

TJ

Internal AHB clock frequency

-

Internal APB1 clock frequency

-

Internal APB2 clock frequency

-

Standard operating voltage

-

Analog operating voltage

(OPAMP and DAC not used)

Analog operating voltage

(OPAMP and DAC used)

Must have a potential

equal to or higher than

VDD

Backup operating voltage

-

TC I/O

TT I/O(1)

I/O input voltage

TTa I/O pins

FT and FTf I/O(1)

BOOT0

Power dissipation at

TA = 85 °C for suffix 6 or

TA = 105 °C for suffix 7(2)

Ambient temperature for 6

suffix version

LQFP64

LQFP48

Maximum power

dissipation

Low power dissipation(3)

Ambient temperature for 7

suffix version

Maximum power

dissipation

Low power dissipation(3)

Junction temperature range

6 suffix version

7 suffix version

0

72

0

36

MHz

0

72

2

3.6

V

2

3.6

V

2.4

3.6

1.65

3.6

V

–0.3 VDD+0.3

-0.3

3.6

–0.3 VDDA+0.3 V

–0.3

5.5

0

5.5

-

444 mW

-

364 mW

–40

85

°C

–40

105

–40

105

°C

–40

125

–40

105

°C

–40

125

1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Table 78: Package

thermal characteristics.

3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax. See

Table 78: Package thermal characteristics

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