S25FL256SDPMFVC03 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
S25FL256SDPMFVC03
Cypress Semiconductor
S25FL256SDPMFVC03 Datasheet PDF : 144 Pages
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S25FL128S, S25FL256S
6.2 WSON Package
6.2.1
WSON Connection Diagram
Figure 6.2 Leadless Package (WSON), Top View
CS#
SO/IO1
WP#/IO2
VSS
Note:
RESET# and VIO are pulled to VCC internal to the memory device.
6.2.2
WSON Physical Diagram
1
8
2
7
WSON
3
6
4
5
VCC
HOLD#/IO3
SCK
SI/IO0
WNG008 — WSON 8-Contact (6 x 8 mm) No-Lead Package
PACKAGE
SYMBOL
e
N
ND
L
b
D2
E2
D
E
A
A1
K
WNG008
MIN
NOM
MAX
1.27 BSC.
8
4
0.45
0.50
0.55
0.35
0.40
0.45
4.70
4.80
4.90
4.55
4.65
4.75
6.00 BSC
8.00 BSC
0.70
0.75
0.80
0.00
0.02
0.05
0.20 MIN.
NOTE
3
5
4
NOTES:
1. DIMENSIONING AND TOLERANCING CONFORMS TO
ASME Y14.5M - 1994.
2. ALL DIMENSIONS ARE IN MILLMETERS.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4 DIMENSION “b” APPLIES TO METALLIZED TERMINAL AND IS
MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL
TIP. IF THE TERMINAL HAS THE OPTIONAL RADIUS ON THE
OTHER END OF THE TERMINAL, THE DIMENSION “b”
SHOULD NT BE MEASURED IN THAT RADIUS AREA.
5 ND REFER TO THE NUMBER OF TERMINALS ON D SIDE.
6. MAX. PACKAGE WARPAGE IS 0.05mm.
7. MAXIMUM ALLOWABLE BURRS IS 0.076mm IN ALL DIRECTIONS.
8 PIN #1 ID ON TOP WILL BE LASER MARKED.
9 BILATERAL COPLANARITY ZONE APPLIES TO THE EXPOSED
HEAT SINK SLUG AS WELL AS THE TERMINALS.
10 A MAXIMUM 0.15mm PULL BACK (L1) MAY BE PRESENT.
Document Number: 001-98283 Rev. *I
g1016 \ 16-038.30 \ 07.21.11
Page 40 of 144
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