TDA7719TR(2008) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TDA7719TR
(Rev.:2008)

3 band car audio processor

STMicroelectronics 

TDA7719

6

Package information

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 21. TSSOP28 mechanical data and package dimensions

DIM.

MIN.

mm

TYP. MAX. MIN.

inch

TYP. MAX.

A

1.200

0.047

A1 0.050

0.150 0.002

0.006

A2 0.800 1.000 1.050 0.031 0.039 0.041

b 0.190

0.300 0.007

0.012

c 0.090

0.200 0.004

0.008

D 1 9.600 9.700 9.800 0.378 0.382 0.386

E 6.200 6.400 6.600 0.244 0.252 0.260

E11 4.300 4.400 4.500 0.170 0.173 0.177

e

0.650

0.026

L 0.450 0.600 0.750 0.018 0.024 0.030

L1

1.000

0.039

k

0˚ (min.), 8˚ (max.)

aaa

0.100

0.004

Note: 1. D and E1 does not include mold flash or protrusions.

Mold flash or potrusions shall not exceed 0.15mm

(.006inch) per side.

OUTLINE AND

MECHANICAL DATA

TSSOP28

Thin Shrink Small Outline Package

JEDEC MO-153-AC

0128292 B

43/45

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