ERASE AND PROGRAMMING PERFORMANCE
Parameter
Chip/Sector Erase Time
Byte Programming Time
Word Programming Time
Chip Programming Time (Note 3)
Typ (Note 1)
1.5
14
28
1.8
Limits
Max (Note 2)
15
1000
2000
12.5
Unit
Comments
sec
Excludes 00h programming prior to
erasure (Note 4)
µs
µs
Excludes system-level overhead
(Note 5)
sec
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 5.0 V VCC, 100,000 cycles. Additionally,
programming typicals assume checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 4.5 V, 100,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only then
does the device set DQ5 = 1. See the section on DQ5 for further information.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 1
for further information on command definitions.
6. The device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles.
LATCHUP CHARACTERISTIC
Parameter Description
Input Voltage with respect to VSS on I/O pins
VCC Current
Note: Includes all pins except VCC. Test conditions: VCC = 5.0 Volt, one pin at a time.
Min
–1.0 V
–100 mA
Max
VCC + 1.0 V
+100 mA
TSOP AND SO PIN CAPACITANCE
Parameter
Symbol
Parameter Description
CIN
COUT
CIN2
Input Capacitance
Output Capacitance
Control Pin Capacitance
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
Test Conditions
VIN = 0
VOUT = 0
VIN = 0
Typ Max Unit
6
7.5
pF
8.5
12
pF
8
10
pF
DATA RETENTION
Parameter Description
Minimum Pattern Data Retention Time
Test Conditions
Min
150°C
10
125°C
20
Unit
Years
Years
Am29F100
34