ADP3335
OUTLINE DIMENSIONS
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
1.84
1.74
1.64
5
0.50 BSC
8
TOP VIEW
0.30
0.25
0.20
0.50
0.40
0.30
EXPOSED
PAD
1.55
1.45
1.35
4
1
BOTTOM VIEW
PIN 1
INDICATOR
(R 0.15)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-13)
Dimensions shown in millimeters
3.20
3.00
2.80
3.20
3.00
2.80
8
5
5.15
4.90
4.65
1
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
15° MAX
0.85
1.10 MAX
0.75
0.15
0.05
0.40
COPLANARITY
0.25
6°
0.23
0°
0.09
0.80
0.55
0.40
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 27. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Data Sheet
Rev. D | Page 12 of 16