ADM231LAN View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADM231LAN Datasheet PDF : 16 Pages
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ADM223/ADM230L–ADM241L
24-Lead Cerdip (Q-24)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead SOIC (R-28)
24
PIN 1
1
13 0.295
(7.493)
12 MAX
0.320 (8.128)
0.290 (7.366)
0.225
(5.715)
MAX
1.290 (32.77) MAX
0.180
(4.572)
MAX
0.125
(3.175)
MIN
0.021 (0.533) 0.110 (2.794)
0.015 (0.381) 0.090 (2.286)
TYP
TYP
SEATING
PLANE
0.070 (1.778)
0.065 (1.651) 0.020 (0.508)
0.055 (1.397)
15؇
0؇
TYP
0.012 (0.305)
0.008 (0.203)
TYP
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.
2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
28
PIN 1
1
0.708 (18.02)
0.696 (17.67)
15
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
14
0.398 (10.10)
0.096 (2.44)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.01 (0.254)
0.006 (0.15)
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
6؇
0.013 (0.32) 0؇
0.009 (0.23)
0.042 (1.067)
0.018 (0.457)
1. LEAD NO. IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24
PIN 1
1
24-Lead SOIC (R-24)
0.608 (15.45)
0.596 (15.13)
13
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
0.398 (10.10)
12
0.096 (2.44)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.01 (0.254)
0.006 (0.15)
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
6؇
0.013 (0.32) 0؇
0.009 (0.23)
0.042 (1.067)
0.018 (0.447)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
28-Lead SSOP (RS-28)
0.407 (10.34)
0.397 (10.08)
28
PIN 1
1
15
0.212 (5.38)
0.205 (5.207)
0.311 (7.9)
0.301 (7.64)
14
0.07 (1.78)
0.066 (1.67)
0.008 (0.203)
0.002 (0.050)
0.0256 (0.65)
BSC
8؇
0؇
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
ADM223/ADM230L–ADM241L–Revision History
Location
Page
05/01
Data Sheet changed from REV. A to REV. B.
Edits to Test Conditions/Comments of Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Location
Page
01/01
Data Sheet changed from REV. 0 to REV. A.
Removed ESD information from FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIFICATIONS changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Removed ESD information from ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
–16–
REV. B
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