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STPS1L40 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STPS1L40
STMICROELECTRONICS
STMicroelectronics 
STPS1L40 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Characteristics
Figure 7: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB)
Zth(j-a)/Rth(j-a)
1.0
0.9
SMB
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
t P (s)
1.E+02
1.E+03
STPS1L40
Figure 8: Relative variation of thermal impedance
junction to lead versus pulse duration
(SOD123Flat)
Zth(j-l)/Rth(j-l)
1.0
SOD123Flat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 Single pulse
0.0
1.E-04
1.E-03
1.E-02
1.E-01
t P (s)
1.E+00
1.E+01
Figure 9: Reverse leakage current versus reverse
voltage applied (typical values)
IR(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0
5
Tj = 150 °C
Tj = 125 °C
Tj = 100 °C
Tj = 75 °C
Tj = 50 °C
Tj = 25 °C
VR(V)
10
15
20
25
30
35
40
Figure 10: Junction capacitance versus reverse
voltage applied (typical values)
C(pF)
1000
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
100
10
1
VR(V)
10
100
Figure 11: Forward voltage drop versus forward
current (typical values)
IF (A)
10.00
1.00
Tj = 125 °C
0.10
Tj = 25 °C
Tj = 75 °C
0.01
VF(V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Figure 12: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Rth(j-a)(°C/W)
200
SMA
150
100
Epoxy printed board FR4, eCu = 35 µm
50
SCu (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/13
DocID5507 Rev 7

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