PIC32MX250F128C-I/SO View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC32MX250F128C-I/SO

32-bit Microcontrollers (up to 128 KB Flash and 32 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

Microchip Technology 

PIC32MX1XX/2XX

29.1 DC Characteristics

TABLE 29-1: OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temp. Range

(in °C)

DC5

DC5b

2.3-3.6V

2.3-3.6V

-40°C to +85°C

-40°C to +105°C

Max. Frequency

PIC32MX1XX/2XX

40 MHz

40 MHz

TABLE 29-2: THERMAL OPERATING CONDITIONS

Rating

Industrial Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

V-temp Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD – S IOH)

I/O Pin Power Dissipation:

I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))

Maximum Allowed Power Dissipation

Symbol Min. Typical Max. Unit

TJ

-40

—

+125

°C

TA

-40

—

+85

°C

TJ

-40

—

+140

°C

TA

-40

—

+105

°C

PD

PINT + PI/O

W

PDMAX

(TJ – TA)/θJA

W

TABLE 29-3: THERMAL PACKAGING CHARACTERISTICS

Characteristics

Symbol Typical Max. Unit Notes

Package Thermal Resistance, 28-pin SSOP

θJA

71

—

°C/W

1

Package Thermal Resistance, 28-pin SOIC

θJA

50

—

°C/W

1

Package Thermal Resistance, 28-pin SPDIP

θJA

42

—

°C/W

1

Package Thermal Resistance, 28-pin QFN

θJA

35

—

°C/W

1

Package Thermal Resistance, 36-pin VTLA

θJA

31

—

°C/W

1

Package Thermal Resistance, 44-pin QFN

θJA

32

—

°C/W

1

Package Thermal Resistance, 44-pin TQFP

θJA

45

—

°C/W

1

Package Thermal Resistance, 44-pin VTLA

θJA

30

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.

DS61168C-page 246

Preliminary

© 2011 Microchip Technology Inc.

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