STM32F303RCT7 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM32F303RCT7
STMicroelectronics
STM32F303RCT7 Datasheet PDF : 133 Pages
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Package characteristics
STM32F302xx/STM32F303xx
7.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 22: General operating conditions on page 58.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
● TA max is the maximum ambient temperature in °C,
● ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 79. Package thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
ΘJA
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Value
45
55
41
Unit
°C/W
7.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
126/133
Doc ID 023353 Rev 5
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