ST72324XX-AUTO View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72324XX-AUTO

8-bit MCU for automotive, 3.8 to 5.5V operating range with 8 to 32 Kbyte Flash, 10-bit ADC, 4 timers, SPI, SCI

STMicroelectronics 

ST72324xx-Auto

Package characteristics

13.3 Thermal characteristics

Table 114. Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to ambient):

LQFP44 10x10

LQFP32 7x7

52

70

°C/W

PD

TJmax

Power dissipation(1)

Maximum junction temperature(2)

500

mW

150

°C

1. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD = PINT + PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the

) application.

t(s 2. The maximum chip-junction temperature is based on technology characteristics.

lete Produc 13.4

Ecopack information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Obsolete Product(s) - Obso 13.5

Packaging for automatic handling

The devices can be supplied in trays or with tape and reel conditioning.

Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when

facing the tape sprocket holes as shown in Figure 92.

Figure 92. pin 1 orientation in tape and reel conditioning

Left orientation

Right orientation (EIA 481-C compliant)

Pin 1

Pin 1

See also Figure 93: ST72F324xx-Auto Flash commercial product structure on page 181.

Doc ID 13841 Rev 1

177/193

Share Link: