M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF
Revision history
Table 23. Document revision history (continued)
Date
Revision
Changes
Updated UFDFPN8 silhouette on cover page, Figure 16: UFDFPN8
16-Nov-2011
25
(MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm,
outline and Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual
flat package no lead 2 x 3 mm, mechanical data to add MC version.
Datasheet revision 25 split into:
– M24256-125 datasheet for automotive products (range 3),
– M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF (this
datasheet) for standard products (range 6).
Added:
– Reference M24256-DF
– Table 1: Signal names, Table 12: Memory cell data retention
Updated:
22-Jun-2012
26 – Table 16: 400 kHz AC characteristics and Table 17: 1 MHz AC
characteristics: added set up and hold timing conditiions on WC (tWLDL
and tDHWH)
– Figure 18: M24256-DFCS6TP/K, WLCSP 8-bump wafer-level chip
scale package outline and Table 21: M24256-DFCS6TP/K, WLCSP 8-
bump wafer-level chip scale package mechanical data
– Cycling and data retention limits
Deleted:
– UFDFPN8, package revision MB
Updated Figure 3: WLCSP connections for the M24256-DFCS6TP/K (top
01-Aug-2012 27 view, marking side, with balls on the underside) and Figure 18: M24256-
DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline.
Changed title of Figure 3: WLCSP connections for the M24256-
18-Sep-2012 28 DFCS6TP/K (top view, marking side, with balls on the underside).
Updated Section 5.2.2: Current Address Read.
20-Nov-2012 29 Corrected “Device family” data in Table 22: Ordering information scheme.
Deleted note (3) under Table 2: Device select code.
Modified ICCO condition in Table 14: DC characteristics (M24256-BR,
M24256-DR, device grade 6).
17-Dec-2012 30
Deleted incorrect table (Table 15. DC characteristics (M24256-R, device
grade 6)).
Updated package list in Table 22: Ordering information scheme.
Doc ID 6757 Rev 30
39/40