Maximum rating
4
Maximum rating
STM6321/6322STM6821/6822/6823/6824/6825
Stressing the device above the rating listed in the Table 4 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not
implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 4. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG
TSLD(1)
VIO
VCC
IO
PD
Storage Temperature (VCC Off)
Lead Solder Temperature for 10 seconds
Input or Output Voltage
Supply Voltage
Output Current
Power Dissipation
–55 to 150
°C
260
°C
–0.3 to VCC +0.3
V
–0.3 to 7.0
V
20
mA
320
mW
1. Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C for greater than 30 seconds).
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