STPS5L25B-1 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS5L25B-1 Datasheet PDF : 5 Pages
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STPS5L25B/B-1
Fig. 3: Non repetitive surge peak forward current Fig. 4: Relative variation of thermal impedance
versus overload duration (maximum values).
junction to case versus pulse duration.
IM(A)
100
80
60
40
20 IM
t
δ=0.5
0
1E-3
1E-2
t(s)
1E-1
Tc=25°C
Tc=75°C
Tc=100°C
1E+0
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6
δ = 0.5
0.4
δ = 0.2
0.2
δ = 0.1
0.0
1.0E-4
Single pulse
tp(s)
1.0E-3
1.0E-2
T
δ=tp/T
1.0E-1
tp
1.0E+0
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
3E+2
1E+2
Tj=150°C
1E+1
Tj=125°C
1E+0
1E-1
1E-2
1E-3
0
Tj=25°C
VR(V)
5
10
15
20
25
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
2000
1000
F=1MHz
Tj=25°C
500
200
100
1
2
VR(V)
5
10
20 30
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
IFM(A)
100.0
Typical values
Tj=150°C
10.0
Tj=125°C
1.0
Tj=25°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
100
80
60
40
20
0
0 2 4 6 8 10 12 14 16 18 20
S(Cu) (cm²)
3/5
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