L6229DP View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
L6229DP Datasheet PDF : 33 Pages
| |||
Application information
L6229
Figure 23. Typical application
96
9'&
&
32:(5
*5281'
6,*1$/
*5281'
9
5+
5+
5+
&
'
53
'
&%227
56(16(
3+$6(02725
+$//
6(1625
0
96$
96%
&39&3
9%227
6(16($
6(16(%
287
287
287
+
+
+
*1'
',1Y
95()
&5()
5
5
&
95()
&5()
',$*
(1
):'5(9
%5$.(
7$&+2
5(1
&(1
&2))
5&2))
5&38/6(
52))
&38/
538/
5
(1$%/(
5
):'5(9
%5$.(
5''
9
11.1
Output current capability and IC power dissipation
In Figure 24 is shown the approximate relation between the output current and the IC power
dissipation using PWM current control.
For a given output current the power dissipated by the IC can be easily evaluated, in order
to establish which package should be used and how large must be the on-board copper
dissipating area to guarantee a safe operating junction temperature (125 °C maximum).
Figure 24. IC power dissipation versus output power
,
,287
3'>:@
,287>$@
,
,287
,
,287
7HVWF RQGLWLRQV
6XSSO\ YROWDJH 9
1R3:0
I6: N+] VORZGHFD\
$0
26/33
DocID9455 Rev 5
Share Link: 