Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.65
BSC
0.35
0.30
0.25
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
2.60
2.50 SQ
2.40
0.50
0.40
9
8
4
5
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADP2164ACPZ-R7
ADP2164ACPZ-1.0-R7
ADP2164ACPZ-1.2-R7
ADP2164ACPZ-1.5-R7
ADP2164ACPZ-1.8-R7
ADP2164ACPZ-2.5-R7
ADP2164ACPZ-3.3-R7
ADP2164-EVALZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Output Voltage
Adjustable
1.0 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
Package Description
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
Evaluation Board
ADP2164
Package Option
CP-16-26
CP-16-26
CP-16-26
CP-16-26
CP-16-26
CP-16-26
CP-16-26
Rev. 0 | Page 19 of 20