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ADP2164ACPZ-3.3-R7(Rev0) View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
ADP2164ACPZ-3.3-R7
(Rev.:Rev0)
ADI
Analog Devices 
ADP2164ACPZ-3.3-R7 Datasheet PDF : 20 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
PVIN, VIN, SW
FB, SYNC, TRK, RT, EN, PGOOD
PGND to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP2164
THERMAL RESISTANCE
θJA is measured using natural convection on a JEDEC 4-layer
board. The exposed pad is soldered to the printed circuit board
with thermal vias.
Table 3. Thermal Resistance
Package Type
θJA
16-Lead LFCSP
38.3
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 5 of 20

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