ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range (Soldering, 60 sec)
ESD
Rating
6V
GND to VS
±6 V
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
2 kV HBM
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD8601/AD8602/AD8604
THERMAL RESISTANCE
θJA is specified for worst-case conditions, that is, a device
soldered onto a circuit board for surface-mount packages using
a standard 4-layer board.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
5-Lead SOT-23 (RJ)
190
92
°C/W
8-Lead SOIC (R)
120
45
°C/W
8-Lead MSOP (RM)
142
45
°C/W
14-Lead SOIC (R)
115
36
°C/W
14-Lead TSSOP (RU)
112
35
°C/W
16-Lead QSOP (RQ)
115
36
°C/W
ESD CAUTION
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