USB2512AI View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

USB2512AI

USB 2.0 Hi-Speed Hub Controller

Microchip Technology 

USB251xB/xBi

6.2.1 PACKAGE THERMAL SPECIFICATIONS

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi-

layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are

based on the package body, die size, maximum power consumption, 85°C ambient temperature, and 125°C junction

temperature of the die.

Symbol

JA

JT

JC

USB2512B/12Bi USB2513B/13Bi

USB2514B/14Bi

(°C/W)

40.1

35.0

0.5

0.7

6.3

6.3

Velocity (meters/s)

0

1

0

1

0

1

Use the following formulas to calculate the junction temperature:

TJ = P x JA + TA

TJ = P x JT + TT

TJ = P x JC + TC

Max Power Supported = (TJ Max. Spec. x TAmb.)/ JA

TABLE 6-9: LEGEND

Symbol

Description

TJ

Junction temperature

P

Power dissipated

JA

Junction-to-ambient-temperature

JC

Junction-to-top-of-package

JT

Junction-to-bottom-of-case

TA

Ambient temperature

TC

Temperature of the bottom of the case

TT

Temperature of the top of the case

 2010 - 2015 Microchip Technology Inc.

DS00001692C-page 43

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