ADV7403BSTZ-110 View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADV7403BSTZ-110
Analog Devices
ADV7403BSTZ-110 Datasheet PDF : 20 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD to AGND
DVDD to DGND
PVDD to AGND
DVDDIO to DGND
DVDDIO to AVDD
PVDD to DVDD
DVDDIO to PVDD
DVDDIO to DVDD
AVDD to PVDD
AVDD to DVDD
Digital Inputs Voltage to DGND
Digital Outputs Voltage to DGND
Analog Inputs to AGND
Maximum Junction
Temperature (TJ MAX)
Storage Temperature Range
Infrared Reflow Soldering
(20 sec)
Rating
4V
2.2 V
2.2 V
4V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +2 V
−0.3 V to +2 V
−0.3 V to +2 V
−0.3 V to +2 V
DGND − 0.3 V to DVDDIO + 0.3 V
DGND − 0.3 V to DVDDIO + 0.3 V
AGND − 0.3 V to AVDD + 0.3 V
125°C
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADV7403
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the device, the user
is advised to turn off any unused ADCs.
Keep the junction temperature less than the maximum junction
temperature (TJ MAX) of 125°C. The junction temperature is
calculated by
TJ = TA MAX + (θJA × WMAX)
where:
TA MAX = 85°C.
θJA = 30°C/W.
WMAX = ((AVDD × IAVDD)+(DVDD × IDVDD)+ (DVDDIO ×
IDVDDIO) + (PVDD × IPVDD)).
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6.
Package Type
100-Lead LQFP
θJA1
θJC2
Unit
30
7
°C/W
1 It is a 4-layer printed circuit board (PCB) with a solid ground plane (still air).
2 It is a 4-layer PCB with a solid ground plane.
ESD CAUTION
Rev. B | Page 9 of 20
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