ST72325
EMC CHARACTERISTICS (Cont’d)
12.7.2 Electro Magnetic Interference (EMI)
Based on a simple application running on the
product (toggling 2 LEDs through the I/O ports),
the product is monitored in terms of emission. This
emission test is in line with the norm SAE J 1752/
3 which specifies the board and the loading of
each pin.
Symbol
Parameter
Conditions
Monitored
Frequency Band
SEMI Peak level
SEMI Peak level
SEMI Peak level
48/60K Flash Devices:
0.1MHz to 30MHz
VDD=5V, TA=+25°C,
30MHz to 130MHz
TQFP44 10x10 package 130MHz to 1GHz
conforming to SAE J 1752/3 SAE EMI Level
8/16/32K/Flash Devices: 0.1MHz to 30MHz
VDD=5V, TA=+25°C,
30MHz to 130MHz
TQFP44 10x10 package 130MHz to 1GHz
conforming to SAE J 1752/3 SAE EMI Level
ROM devices: VDD=5V,
TA=+25°C,
0.1MHz to 30MHz
30MHz to 130MHz
TQFP44 10x10 package 130MHz to 1GHz
conforming to SAE J 1752/3 SAE EMI Level
Notes:
1. Data based on characterization results, not tested in production.
2. Refer to Application Note AN1709 for data on other package types.
Max vs. [fOSC/fCPU]1
8/4MHz 16/8MHz
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
13
14
20
25
16
21
3
3.5
17
21
24
30
18
23
3
3.5
Unit
dBµV
-
dBµV
-
dBµV
-
156/193