ST72325AR9B5 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72325AR9B5

8-BIT MCU WITH 16 TO 60K FLASH/ROM, ADC, CSS, FIVE TIMERS, SPI, SCI, I2C INTERFACE

STMicroelectronics 

ST72325

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

TQFP64 10x10

TQFP48 7x7

TQFP44 10x10

SDIP42

TQFP32 7x7

SDIP32

Power dissipation 1)

Maximum junction temperature 2)

Value

50

80

52

55

70

50

500

150

Unit

°C/W

mW

°C

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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