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ST72325J4B5 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST72325J4B5 Datasheet PDF : 193 Pages
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ST72325
13.2 THERMAL CHARACTERISTICS
Symbol
RthJA
PD
TJmax
Ratings
Package thermal resistance (junction to ambient)
TQFP64 10x10
TQFP48 7x7
TQFP44 10x10
SDIP42
TQFP32 7x7
SDIP32
Power dissipation 1)
Maximum junction temperature 2)
Value
50
80
52
55
70
50
500
150
Unit
°C/W
mW
°C
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
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