LTC2912HDDB2-TRMPBF View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
LTC2912HDDB2-TRMPBF Datasheet PDF : 14 Pages
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LTC2912
PACKAGE DESCRIPTION
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
0.61 ±0.05
(2 SIDES)
0.70 ±0.05
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
5
0.40 ±0.10
8
2.55 ±0.05
1.15 ±0.05
0.25 ±0.05
0.50 BSC
2.20 ±0.05
(2 SIDES)
PACKAGE
OUTLINE
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.56 ±0.05
(2 SIDES)
4
0.25 ±0.05
PIN 1
R = 0.20 OR
0.25 × 45°
1
CHAMFER
(DDB8) DFN 0905 REV B
0.50 BSC
0 – 0.05
2.15 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40
MAX
3.85 MAX 2.62 REF
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637 Rev A)
0.65
REF
2.90 BSC
(NOTE 4)
1.22 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.65 BSC
0.80 – 0.90
1.00 MAX
12
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
For more information www.analog.com
1.95 BSC
0.22 – 0.36
8 PLCS (NOTE 3)
0.01 – 0.10
TS8 TSOT-23 0710 REV A
Rev. C
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