STM32WB55VC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32WB55VC

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

STM32WB55xx STM32WB35xx

Package information

7.2

F

10

G

A

WLCSP100 package information

WLCSP100 is a 100-ball, 4.390 x 4.371 mm, 0.4 mm pitch, wafer level chip scale package.

Figure 41. WLCSP100 outline

e1

A1 BALL LOCATION

A1

1

e4

e2 E

e

DETAIL A

E

K

e

e3

D

BOTTOM VIEW

A3

K

H

A2

D

TOP VIEW

BUMP

A

A2

SIDE VIEW

FRONT VIEW

A1

DETAIL A

ROTATED 90

SEATING PLANE

A08S_WLCSP100_ME_V1

DS11929 Rev 10

173/193

185

Share Link: