AD9742-EB View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

AD9742-EB

12-Bit, 210 MSPS TxDAC D/A converter

Analog Devices 

AD9742

PIN 1

INDICATOR

0.80

0.75

0.70

SEATING

PLANE

5.10

5.00 SQ

4.90

TOP VIEW

0.50

BSC

0.30

0.25

0.18

25

32

24

1

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

17

8

0.50

16

9

0.25 MIN

0.40

BOTTOM VIEW

0.30

0.05 MAX

0.02 NOM

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.20 REF

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

Data Sheet

ORDERING GUIDE

Model1

Temperature Range

AD9742AR

−40°C to +85°C

AD9742ARZ

−40°C to +85°C

AD9742ARZRL

−40°C to +85°C

AD9742ARU

−40°C to +85°C

AD9742ARURL7

−40°C to +85°C

AD9742ARUZ

−40°C to +85°C

AD9742ARUZRL7

−40°C to +85°C

AD9742ACPZ

−40°C to +85°C

AD9742ACPZRL7

−40°C to +85°C

AD9742-EBZ

AD9742ACP-PCBZ

1 Z = RoHS Compliant Part.

Package Description

28-Lead Standard Small Outline Package [SOIC]

28-Lead Standard Small Outline Package [SOIC]

28-Lead Standard Small Outline Package [SOIC]

28-Lead Thin Shrink Small Outline Package [TSSOP]

28-Lead Thin Shrink Small Outline Package [TSSOP]

28-Lead Thin Shrink Small Outline Package [TSSOP]

28-Lead Thin Shrink Small Outline Package [TSSOP]

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

Evaluation Board [SOIC]

Evaluation Board [LFCSP]

Package Option

RW-28

RW-28

RW-28

RU-28

RU-28

RU-28

RU-28

CP-32-7

CP-32-7

Rev. C | Page 30 of 32

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