STP90NF03L/STB90NF03L-1
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDS Drain-source Voltage (VGS = 0)
VDGR Drain-gate Voltage (RGS = 20 kΩ)
VGS Gate- source Voltage
ID
Drain Current (continuous) at TC = 25°C
ID
Drain Current (continuous) at TC = 100°C
IDM ( ) Drain Current (pulsed)
PTOT Total Dissipation at TC = 25°C
Derating Factor
Tstg
Storage Temperature
Tj
Max. Operating Junction Temperature
( ) Pulse width limited by safe operating area
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max
Rthj-amb Thermal Resistance Junction-ambient Max
Tl
Maximum Lead Temperature For Soldering Purpose
Value
30
30
±20
90
65
360
150
0.73
–65 to 175
175
Unit
V
V
V
A
A
A
W
W/°C
°C
°C
1
62.5
300
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
ON /OFF
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
30
Breakdown Voltage
IDSS Zero Gate Voltage
VDS = Max Rating
1
Drain Current (VGS = 0) VDS = Max Rating, TC = 125 °C
10
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ±20V
±100
ID(on) On State Drain Current VDS > ID(on) x RDS(on)max,
90
VGS = 10V
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA
1
2.5
RDS(on)
Static Drain-source On
Resistance
VGS = 10V, ID = 45 A
VGS = 5V, ID = 45 A
0.0056
0.007
0.0065
0.012
Unit
V
µA
µA
nA
A
V
Ω
Ω
2/9