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STP55NF06LFP View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STP55NF06LFP Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STP55NF06L - STP55NF06LFP - STB55NF06L - STB55NF06L-1
THERMAL DATA
Rthj-case
Rthj-amb
Tl
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Maximum Lead Temperature For Soldering Purpose
TO-220
D2PAK
I2PAK
1.58
62.5
300
TO-220FP
5.0
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
±100
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS, ID = 250 µA
VGS = 5 V, ID = 27.5 A
VGS = 10V, ID = 27.5 A
Min.
1
Typ.
1.7
0.016
0.014
Max.
0.020
0.018
Unit
V
DYNAMIC
Symbol
gfs (1)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15V , ID = 27.5 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
30
1700
300
105
Max.
Unit
S
pF
pF
pF
2/12

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